Qingdao New Core Technology

Qingdao New Core Technology

Our Total Solution for Advanced Wafer Level and Fan Out Packaging Needs.

  • Edit
Get premium to view all results
DateInvestorsAmountRound
investor

€0.0

round
*

CNY232m

Early VC
Total Funding000k
Analytics
Unlock the full power of analytics with a premium account
Track company size and historic growth
Track team composition and strength
Track website visits and app downloads