NCAP China

NCAP China, the National Center for Advanced Packaging, is a leading research and development hub focused on the integrated circuit (IC) industry. The company collaborates with system and supply chain partners to offer comprehensive solutions in advanced packaging, testing, and system integration. NCAP serves clients in the microelectronics sector, including manufacturers and developers of ICs, by providing cutting-edge technologies such as 2.5D and 3D packaging, high-density wafer-level packaging, and system-in-package (SiP) product development. The company operates in the Chinese market and aims to build a world-class platform for R&D, commercialization, international technical exchange, and talent mentoring. NCAP generates revenue through the commercialization of its advanced technologies and the transfer of total solutions to the industry.

Keywords: IC packaging, advanced packaging, system integration, microelectronics, R&D, commercialization, 2.5D technology, 3D technology, wafer-level packaging, SiP development.