
Bond180
Providing technology and data solutions for fixed income markets.
USD | 2022 | 2023 |
---|---|---|
Revenues | 0000 | 0000 |
% growth | - | 80 % |
EBITDA | 0000 | 0000 |
Profit | 0000 | 0000 |
EV | 0000 | 0000 |
EV / revenue | 00.0x | 00.0x |
EV / EBITDA | 00.0x | 00.0x |
R&D budget | 0000 | 0000 |
Source: Dealroom estimates
Related Content
Bond180 is a startup that operates in the Artificial Intelligence (AI) technology sector, providing a platform that allows enterprises to leverage AI technologies in a secure and confidential manner. The company's primary offering is encloud, a tool that enables businesses to query Large Language Models (LLM) while ensuring data privacy. This is particularly relevant in today's data-driven world where data privacy and security are paramount.
The company's target market includes businesses of all sizes that are looking to harness the power of AI while maintaining data confidentiality. Bond180's business model is based on providing a platform that simplifies the complexities of confidential computing, allowing for fast prototyping and deployment. This is achieved through a Command Line Interface (CLI) or App, with the flexibility to choose the modules best suited for the problem at hand.
Bond180's revenue generation strategy is likely based on a subscription model, where clients pay for access to the platform and its features. Additionally, the platform's compatibility with the latest AI and embedding models and its ability to deploy on any cloud or bare metal to fit existing IT architecture, makes it a versatile solution for businesses.
In terms of data collaboration, Bond180 ensures that data shared from each source remains confidential and intellectual property (IP) remains protected. This feature allows businesses to gather insights through collaboration by accessing data across silos, without compromising on data security.
Keywords: Artificial Intelligence, Data Privacy, Confidential Computing, Large Language Models, Data Collaboration, Intellectual Property Protection, Cloud Deployment, Fast Prototyping, Flexible Modules, Subscription Model.